Electroplating integrated circuit packaging is simultaneously becoming a more complex and more in-demand service — especially as the U.S. electronics industry has continued to generate annual revenues pushing well past the $200 billion mark since 2012. With the domestic consumer electronics (CE) market estimated to shatter the $300 billion mark in 2018, the number of companies needing copper electroplating for IC substrate manufacturing is constantly growing.
That’s why working with the dedicated surface treatment experts at Sharretts Plating Company is such a prudent choice. On one hand, SPC has more than 90 years of experience supplying companies with top-quality metal finishing solutions. On the other hand, SPC is a true innovator with a cutting-edge facility offering customized electroplating services in an eco-friendly manner.
Plating IC Packages
While the technology for plating IC packages has been around for years, the call for electrochemical deposition (ECD) copper plating has increased dramatically in relation to the rise in 2.5-D and 3-D fan-out technology.
ECD copper plating (also referred to as copper electroplating for IC substrate manufacturing) quickly and cost-effectively deposits uniform copper metallization on wafer-level packages, thereby allowing the desired electrical connections to occur. In addition, because the process combines copper’s high thermal conductivity with its affordability, ECD copper plating is key in producing IC packages with the precise interconnects, redistribution layers and pillars each specific package’s design requires.
The Fundamentals of Electroplating Integrated Circuit Packaging
Whether it’s copper electroplating for IC substrate manufacturing or depositing some other metal on the chip’s surface, the fundamentals of electrochemical deposition (ECD) remain largely the same. Of course, demands for more intricate layers within the IC package can impact the overall complexity of the process. At its core, though, ECD bathes the substrate in electrolytes so the application of an electrical current results in the desired metal affixing to all the predetermined regions of the wafer.
There are other methods that can accomplish nearly the same results, such as sputtering or PVD (physical vapor deposition). But ECD is a much faster process. This means that when it comes to the application of thicker complex films, electroplating is also integral in controlling costs.
SPC Delivers Electroplating Quality
It’s crucial to remember that any company you choose for your electroplating needs is only as good as its ECD equipment and the professionals who operate it. The electroplating process is by and large an irreversible one. Any mistakes in processing are fixed and, therefore, highly wasteful. This is why working with the best-in-class industrial electroplating processes offered by SPC is not only a smart choice to achieve your desired results, but it’s also a strategic decision that can help boost your competitive edge in your industry.
Find out why since 1925, SPC has been a leader in supplying cost-effective metal finishing and plating solutions. You can request a free quote today, or simply contact us with any questions regarding the electroplating needs of your next project. There’s no obligation, and it’s totally confidential.
