The term “micro parts” refers to components that are the size of a dime or even smaller. You can typically find them in products such as medical, telecommunications and electronic devices. Examples of these tiny parts include electrical capacitors, chip connectors, pins, eyelet funnels, interconnect sockets and resistors, to name just a few.
As technology continues to evolve, many of these items are decreasing in size, which creates a demand for these mini components. The parts must fit the product while still meeting its functional requirements.
The Challenges of Plating Small Parts
Many metal micro parts require electroplating or other finishing techniques to improve their corrosion or wear resistance, make them electrically conductive or increase their thickness. However, most traditional plating processes apply to mass-scale operations for larger products. These techniques do not always provide consistent results across all surfaces of smaller parts. The potential for damage when working with these delicate components poses another issue. Consequently, metal finishing companies have developed alternative methods for plating micro parts.
Micro Electroplating Techniques and Equipment
Many plating operations have developed specialized processes and equipment to meet the needs of micro part manufacturers:
- Prototyping: While developing prototypes is a common process for many standard electroplating projects, it becomes even more crucial when working with micro parts. Because of their uniqueness, a “one-size-fits-all” approach will not deliver acceptable results. The plating company must work closely with the manufacturer and may need to create several prototypes to discover the optimal solution.
- Spouted Bed Electrode: SBE is commonly used to apply copper, gold, and nickel plating. The technique works well for smaller parts with flat surfaces and those consisting of complex geometries. The SBE process relies on a continuous flow of the plating solution into and out of a specially designed chamber. This method ensures a fresh flow of the electrolyte throughout the process and that each part experiences uniform coverage.
- Selective plating: Selective plating refers to a portable plating process typically used to enhance or refurbish targeted areas on the surface of a part or component. High-precision electroplating equipment is now available that can perform controlled depth plating of gold or other precious metals onto smaller parts and components with remarkable efficiency. The result is a highly accurate plating technique that delivers superior part-to-part uniformity.
- Solutions to the boundary-layer effect: One specific issue when electroplating small parts is the tendency for fluids to remain in contact with the surface of the component during plating. Metal finishing companies have access to specialized equipment that can minimize this boundary-layer effect by removing liquids from the parts more efficiently.
SPC Can Help With All Your Micro Electroplating Needs
Whether you are working with micro gold components or other small parts, SPC can develop a customized micro electroplating solution for your company. We’ve been delivering the best metal finishing results for manufacturers in a wide range of industries for more than 90 years. Contact us to get your free project quote today.
