About The Author
Upon publishing several reviewed articles in the field of Electrochemical Hydrodynamics, gas evolving, and electroanalytical rotating double-ring electrode systems, Igor Kadija graduated with PhD in Chemical Engineering from the University of Belgrade, Yugoslavia, in 1970. He did a post-doctoral fellowship at Rice University in 1973. He founded ElectroChemical Systems, Inc. (ECSI), in March 1993 in NJ managing ECSI since its inception. In September 2009 he founded ECSI Fibrotools, Inc. in NC. Dr. Kadija has both an excellent scientific background and an entrepreneurial drive. He brings his developmental projects to fruition. By obtaining grants and providing additional financial support of over $1 million, he led both companies with the successful implementation and commercialization of their patents. In 1993, under his leadership ECSI introduced IKoClassic products starting with three US Patents, 5,024,735; 5,114,558; 5,167,747, and four foreign Patents. That established the ECSI’s role for the next 30 years as a worldwide provider of preferred equipment for academic, R&D, and small-scale industrial applications. IKo is currently the smallest footprint and volume R&D electroplating tool on the market. Clients include MIT, NASA, NIST, Naval Research Lab., Draper, DOD, and others. Many are repeat customers.
Dr. Kadija was a Senior Research Scientist in Olin Corporation, New Haven, CT, 1974 – 1986, and a Consultant to AT&T/Lucent Corporation, Murray Hill, NJ, 1987 – 1995. He co-authored 60 U.S. patents and over 30 Foreign patents. He has published over 30 articles in the fields of Electrochemistry and Engineering. Along with D. Bennion, he co-authored a chapter in "Electrochemical Engineering" Editor, Ismail, 1991. To reduce the cost and use of Au for interconnects, Dr. Kadija contributed to the development of 18 Palladium Electroplating processes for Interconnect Surface Finishing and Electroplating instrumentation techniques for AT&T/Lucent Technologies, including QC equipment – the Hydrodynamically Controlled Hull Cell. He received numerous awards for best publications in the field of Electroplating and Surface Finishing. He participated in the development of Olin’s original Cu electroforming technology, enabling Olin Co. to enter the market of electroformed Cu foil for printed circuit board laminates. He supported the commercialization of Olin’s “Black Hole” process for “through hole” electroplating with process clarification and quality control technique optimization.
More recently, in 2018, Dr. Kadija patented the Contact Electroplating Technology, CET, US Patents 10,184,189; 10,480,092. Following the demonstration of the prototype and electric field harnessing, elimination of electric field edge effect, elimination of electroless applications in PWB surface finishing, and through-holes plating, CET technology keeps exhibiting unique results in advanced electronics.
Dr. Kadija coordinates and supervises all projects maintaining responsibility for overall success. Having firsthand understanding of the technology with the best insights, Dr. Kadija works closely with the equipment manufacturers. As a part of the Contract for Manufacturing Under License, Dr. Kadija supervises the transfer of technology to the manufacturer and other customers.
LEARN WHAT OUR MANY SATISFIED CUSTOMERS HAVE TO SAY ABOUT Us
"I would like to thank you for the help you have provided us in developing an electroless nickel plating technique on an unusual substrate. The sample platings you provided show that we should be able to reach our goals. I especially appreciate your willingness to take on an unusual job, with the uncertainties that that entails...We are looking forward to working with you in the future on our plating needs."
– Robert K.
